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Scintillation Detection Arrays (Coupled with Si PDs)

This product is a portfolio of liner Scintillation Detection Arrays; all the modules are coupled with 16-element, 64-element, or even 128-element Front-Side-illumination (FSI) monocrystalline Si photodiodes as the photo readout devices. The detector modules exhibit reliability and versatility for diverse applications that involve non-destructive X-ray inspection (e.g., baggage inspection, portal security, food inspection, etc.). Various scintillation materials, such as CsI(Tl), GOS ceramic screens, CdWO4, etc., could be incorporated. Compared to PMTs, photodiode readouts are advantageous in terms of low cost, excellent electrical current linearity, long life span, and high quantum efficiency (also known as responsivity).

Shalom EO’s scintillation detection arrays feature ultra-low dark current, high response speed, low terminal capacitance, and the photosensitivity spectrum extensively stretches from 350-1100nm, peaking approximately at 950nm. Additionally, this module is compact and lightweight, allowing easy integration, and only requires a low maximum reverse voltage of <10V; the photosensitivity of the diode elements is impressively homogeneous.

Two standard scintillation materials are optional: the CsI(Tl) scintillation detector performs extremely high light output for high energy inspection, the GOS ceramic scintillation detector is for low energy inspections, and CdWO4 scintillation has the virtue of both high light output and low afterglow, making them ideal for PD detectors. The scintillation pixels of one array are separated by a reflector with a wide assortment of selective materials (e.g., MgO2, TiO2, ESR, BaSO4 White Plastic, White Epoxy, etc.) to avert optical crosstalk. A dual-energy X-ray imaging sensor could be obtained by combining one high-energy detector and one low-energy detector at the upper and lower stages. Furthermore, long-size line detectors are formed when aligning multiple detection arrays in a row.

About the specifications, the element size is 1.4mm in width x 2.5mm in height; the element pitch is 1.575mm, apt for compact security inspection systems. CsI(Tl) arrays are mounted on 25.4mm x 10.2mm boards, and GOS arrays are mounted on 25.4mm x 20mm boards. Other customized specifications could also be tailored upon request.

Versions that are integrated with data readout electronics are also available in Shalom EO.

Typical Applications:

  • Non-destructive X-Ray Inspection
  • Security Check
  • Food Inspection
  • Thickness measurement
  • Industrial Process control
  • Mineral Detection
  • Waste Sorting


The manufacturing techniques and structure of GOS scintillation screen:

Figure 1. The structure of GOS scintillation screen

  • The Manufacturing of GOS Scintillation Screen: 
  • Fabricate the mixed powder of Gd2O and 
  • Tb2O3 using the Co-precipitation method 
  • High-temperature vulcanization sintering forms particles of Gd2O
  • Add adhesives to the particles and press the mixture into slices combined with the PET substrate
  • Tile a protective layer to the optical front 
  • The emssion peak of Gd2OS2:Tb 550nm


GOSThickness (μm)
DRZ-STD150
DRZ-STD280
DRZ-HIGH350