Thick Film Metalized Ceramics Substrates, are ceramic substrates screened with conductor, resistor, resistor metal pastes, and fired. The structures and compositions of the thick film ceramic substrates are engineered to achieve certain functions. Shalom EO’s Thick Film Metalized BeO Ceramic Substrates are manufactured using thick-film WMn/MoMn metallization with nickel electroplating, delivering great bonding force, high weldabilities, and excellent tensile strength (>20MPA). Our thick film metalized beryllium oxide ceramic substrates make solid selections for hermetic packaging, suitable microwave PCB pre-forms, and great wire bonding platforms.